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| 4KB Random Read: | 295000 IOPS |
|---|---|
| 4KB Random Write: | 36000 IOPS |
| Capacity: | 1 TB |
| Compatible Bay: | M.2 22110 |
| Compliant Standards: | UL, C-Tick, BSMI, KCC, VCCI, WHCK, WHQL, RoHS |
| Depth: | 110 mm |
| Device Type: | Solid state drive - internal |
| Encryption Algorithm: | 256-bitAES |
| Features: | 64-layer 3D NAND technology, End-to-end data protection, Temperature Monitoring and Logging |
| Form Factor: | M.2 22110 |
| Hardware Encryption: | Yes |
| Interface: | PCIe 3.1 x4 (NVMe) |
| Interfaces: | 1 x PCI Express 3.1 x4 (NVMe) |
| Internal Data Rate: | 2000 MBps (read) / 1430 MBps (write) |
| MTBF: | 2,000,000 hours |
| Manufacturer: | Intel |
| Max Operating Temperature: | 70 °C |
| Min Operating Temperature: | 0 °C |
| NAND Flash Memory Type: | 3D triple-level cell (TLC) |
| Non-Recoverable Errors: | 1 per 10^17 |
| Power Consumption: | 7.6 watt (active) ¦ 3.5 watt (idle) |
| SSD Endurance: | 1.95 PB |
| Shock Tolerance (non-operating): | 1000 g @ 0.5 ms |
| Shock Tolerance (operating): | 1000 g @ 0.5 ms |
| Version: | original |
| Vibration Tolerance (non-operating): | 3.13 g @ 5-800 Hz |
| Vibration Tolerance (operating): | 2.17 g @ 5-700 Hz |
| Weight: | 14 g |
| Width: | 22 mm |
| GPSR - economic actor: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
|---|---|
| GPSR - product manufacturer: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
| GPSR - EU responsible person: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
| EU Data-Act-Url: | https://www.intel.de/content/www/de/de/privacy/intel-privacy-notice.html |
| Warnings: | Warnings Processors International.pdf |
| Safety instructions: | Safety instructions Processors International.pdf |
| 4KB Random Read: | 295000 IOPS |
|---|---|
| 4KB Random Write: | 36000 IOPS |
| Capacity: | 1 TB |
| Compatible Bay: | M.2 22110 |
| Compliant Standards: | UL, C-Tick, BSMI, KCC, VCCI, WHCK, WHQL, RoHS |
| Depth: | 110 mm |
| Device Type: | Solid state drive - internal |
| Encryption Algorithm: | 256-bitAES |
| Features: | 64-layer 3D NAND technology, End-to-end data protection, Temperature Monitoring and Logging |
| Form Factor: | M.2 22110 |
| Hardware Encryption: | Yes |
| Interface: | PCIe 3.1 x4 (NVMe) |
| Interfaces: | 1 x PCI Express 3.1 x4 (NVMe) |
| Internal Data Rate: | 2000 MBps (read) / 1430 MBps (write) |
| MTBF: | 2,000,000 hours |
| Manufacturer: | Intel |
| Max Operating Temperature: | 70 °C |
| Min Operating Temperature: | 0 °C |
| NAND Flash Memory Type: | 3D triple-level cell (TLC) |
| Non-Recoverable Errors: | 1 per 10^17 |
| Power Consumption: | 7.6 watt (active) ¦ 3.5 watt (idle) |
| SSD Endurance: | 1.95 PB |
| Shock Tolerance (non-operating): | 1000 g @ 0.5 ms |
| Shock Tolerance (operating): | 1000 g @ 0.5 ms |
| Version: | original |
| Vibration Tolerance (non-operating): | 3.13 g @ 5-800 Hz |
| Vibration Tolerance (operating): | 2.17 g @ 5-700 Hz |
| Weight: | 14 g |
| Width: | 22 mm |
| GPSR - economic actor: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
|---|---|
| GPSR - product manufacturer: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
| GPSR - EU responsible person: | Intel, Deutschland, Am Campeon 10, Neubiberg, 85579, info.de@intel.com |
| EU Data-Act-Url: | https://www.intel.de/content/www/de/de/privacy/intel-privacy-notice.html |
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